Int. J. Simul. Multidisci. Des. Optim.
Volume 2, Number 2, April 2008Composite and Aircraft Materials
|Page(s)||123 - 133|
|Published online||22 May 2008|
Reliability of the connections used in IGBT modules, in aeronautical environment
THALES Avionics Electrical Systems, 41 boulevard de la République, BP 53, 78401 Chatou, France
2 ENI de Tarbes - LGP, 47, avenue d'Azereix, BP 1629, 65016 Tarbes Cedex, France
3 Université Bordeaux - Laboratoire IMS, 351 cours de la Libération, 33405 Talence Cedex, France
4 PEARL, Alstom Transport Tarbes, rue du Docteur Guinier, BP4, 65600 Séméac, France
Corresponding author: email@example.com
Accepted: 26 March 2008
In this paper, two IGBT modules assembling technologies with double side cooling capabilities and high level of integration were proposed for aeronautic applications after a state of the art and failures analysis. These technologies are compared using design of experiment based on non-linear finite element analysis with various materials, with respect to their potential failures under thermal and power loading profiles. The configurations optimizing the lifetime and reliability level were pointed out by loading profile and failure mode. Recommendations were then done in order to choose the optimal configuration of assembly for each application. Finally, these design rules were followed by the study of parts dimensions effects on the design outputs in order to help dimensioning the IGBT modules.
Key words: Power electronic packaging / constitutive laws / failures criteria / FEM / DoE.
© ASMDO, EDP Sciences, 2008
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