Open Access
Optimal design of Vertical-Taking-Off-and-Landing UAV wing using multilevel approach
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 26
Published online: 16 December 2020
International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO)
The International Journal for Simulation and Multidisciplinary Design Optimization is a peer-reviewed journal covering all aspects related to the simulation and multidisciplinary design optimization. Read more
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Open Access
LSTM based Ensemble Network to enhance the learning of long-term dependencies in chatbot
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 25Published online: 04 December 2020 -
Open Access
Celebration of the centenary of a major scientific milestone thanks to Heinrich Barkhausen
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 24Published online: 01 December 2020 -
Open Access
Effect of face width of spur gear on bending stress using AGMA and ANSYS
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 23Published online: 22 October 2020 -
Open Access
The frame optimization and validation of resistance spot welding gun
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 22Published online: 25 September 2020 -
Open Access
Multi-attribute decision making parametric optimization in two-stage hot cascade vortex tube through grey relational analysis
Int. J. Simul. Multidisci. Des. Optim., 11 (2020) 21Published online: 25 September 2020
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Open Access
Three-dimensional stress-based topology optimization using SIMP methodInt. J. Simul. Multidisci. Des. Optim., 10 (2019) A1
Published online: 12 March 2019
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| 25 |
Open Access
Review
Optimal tightening process of bolted jointsInt. J. Simul. Multisci. Des. Optim., 7 (2016) A4
Published online: 19 September 2016
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Open Access
Topology optimization of steering knuckle structureInt. J. Simul. Multidisci. Des. Optim., 11 (2020) 4
Published online: 24 January 2020
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| 21 |
Open Access
Optimal design of Vertical-Taking-Off-and-Landing UAV wing using multilevel approachInt. J. Simul. Multidisci. Des. Optim., 11 (2020) 26
Published online: 16 December 2020
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| 17 |
Open Access
Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1AgInt. J. Simul. Multidisci. Des. Optim., 10 (2019) A11
Published online: 01 July 2019
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