Int. J. Simul. Multidisci. Des. Optim.
Volume 11, 2020
|Number of page(s)||6|
|Published online||10 August 2020|
Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni
Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kochi,
Kerala 682022, India
2 Intelligence Quality, Guindy, 600032, Chennai
* e-mail: Jayesh.email@example.com
Accepted: 2 July 2020
Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.
Key words: Design of experiments / factorial regression / lead free / solder alloy
© Jayesh S et al., published by EDP Sciences, 2020
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