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Cited article:

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Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R

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Investigations on the Corrosion Properties of Sn–1Cu–1Ni–xAg Lead Free Solders in 3.5% NaCl Solution

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Protection of Metals and Physical Chemistry of Surfaces 57 (4) 858 (2021)
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Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution

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Transactions on Electrical and Electronic Materials 22 (2) 150 (2021)
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Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni

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International Journal for Simulation and Multidisciplinary Design Optimization 11 18 (2020)
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Experimental Investigations on Impact Toughness and Shear Strength of Lead Free Solder Alloy Sn–0.5Cu–3Bi–xAg

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Transactions on Electrical and Electronic Materials 21 (2) 191 (2020)
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CFD simulation for evaluation of optimum heat transfer rate in a heat exchanger of an internal combustion engine

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International Journal for Simulation and Multidisciplinary Design Optimization 11 6 (2020)
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