Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R | International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO)

Simulation and Optimization for Industry 4.0

Open Access

Table 8

Simulation results of chip-scale package.

Data Description	Results

	Ball/Substrate Solder Joint	Ball/Test Board Solder Joint
Failure Joint (From Center)	7	8
Delta Plastic Work/Cycle (MPa)	0.4987	0.2034
Delta Plastic Work/Cycle (psi)	72.33	29.51
Crack Initiation (cycles)	33	131
Crack Growth Rate (mm/cycle)	0.9883 × 10⁻⁰³
Solder Joint Diameter (mm)	0.2800	0.2800
Crack Propagation (cycles)	283	682
Characteristic Life (cycles)	317	813
Model Size Info.
Total Model Nodes	7035
Total Model Elements	317

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