| Issue |
Int. J. Simul. Multidisci. Des. Optim.
Volume 13, 2022
Simulation and Optimization for Industry 4.0
|
|
|---|---|---|
| Article Number | 7 | |
| Number of page(s) | 19 | |
| DOI | https://doi.org/10.1051/smdo/2021038 | |
| Published online | 06 January 2022 | |
Research Article
Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R
1
Normandie Univ, INSA Rouen, LMN, 76000 Rouen, France
2
Hassan First University, Faculté des Sciences et Techniques, LIMII, BP: 577, Settat, Morocco
* e-mail: hamidelhamdani@gmail.com
Received:
31
August
2021
Accepted:
8
November
2021
The complexity challenges of mechatronic systems justify the need of numerical simulation to efficiently assess their reliability. In the case of solder joints in electronic packages, finite element methods (FEM) are commonly used to evaluate their fatigue response under thermal loading. Nevertheless, Experience shows that the prediction quality is always affected by the variability of the design variables. This paper aims to benefit from the statistical power of the R software and the efficiency of the finite element software ANSYS©, to develop a probabilistic approach to predicting the solder joint reliability in Mechatronic Packaging taking into account the uncertainties in material properties. The coupling of the two software proved an effective evaluation of the reliability of the T-CSP using the proposed method.
Key words: R / ANSYS© / chip-scale packages / solder joint / kriging metamodel / finite element analysis / Monte-Carlo Simulation
© H. Hamdani et al., Published by EDP Sciences, 2022
This is an Open Access article distributed under the terms of the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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