Open Access
Table 6
Tape based chip-scale package details [7].
| Mold Cap | Die | Die Attach | Metal Layer | Adhesive Layer | Tape Substrate | Via Type |
|---|---|---|---|---|---|---|
| 0.7mm EME7730 | 0.3048 mm Silicon | 0.0445 mm 84-3MVB | 0.025mm Copper | N/A | 0.050 mm Kapton-E | Generic Etched |
| Via Plug | Via Hole Top Dia. | Via Hole Bottom Dia. | Substrate Joint Dia. | PCB Joint Dia | Solder Ball Stdoff. Ht. | Solder Ball Ctr. Dia. |
| N/A | 0.2800 mm | 0.4206 mm | 0.2800 mm | 0.2800 mm | 0.2860 mm | 0.4640 mm |
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