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Table 2

Properties of the components.

Sl no. Materials Young's modulus (Gpa) Poisson's ratio Density (Kg/m3)
1 PCB 25 0.27 3400
2 Solder ball(Sn-1Cu-1Ni-1Ag) 49.4 0.27 7309
3 Molding component 20.57 0.3 1880

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