International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO) - 即将发表

  • Finite Element Modeling and Random Vibration Analysis of BGA Electronic Package Soldered Using Lead Free Solder Alloy - Sn-1Cu-1Ni-1Ag
    JAYESH S and Jacob Elias
    Accepted: 13/06/2019
  • Heuristic Dynamic Approach to Perishable Products in Presence of Deterioration Effect
    Abdulaziz Turki Almaktoom and Raghad O. Bahebshi
    Accepted: 17/05/2019