International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO) - 即将发表
- Finite Element Modeling and Random Vibration Analysis of BGA Electronic Package Soldered Using Lead Free Solder Alloy - Sn-1Cu-1Ni-1Ag
JAYESH S and Jacob Elias
Accepted: 13/06/2019 - Heuristic Dynamic Approach to Perishable Products in Presence of Deterioration Effect
Abdulaziz Turki Almaktoom and Raghad O. Bahebshi
Accepted: 17/05/2019