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被引用的文献:
A. Micol , C. Martin , O. Dalverny , M. Mermet-Guyennet , M. Karama
Int. J. Simul. Multidisci. Des. Optim., 2 2 (2008) 149-156
网上发表: 2008-05-22
此篇文献已被以下文献引用:
5 articles
Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws
Carmen Martin, Alexandre Micol and François Pérès Microelectronics Reliability 82 213 (2018) https://doi.org/10.1016/j.microrel.2018.01.006
Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment
Carmen Martin, Alexandre Micol and François Pérès Structural and Multidisciplinary Optimization 54 (6) 1455 (2016) https://doi.org/10.1007/s00158-016-1578-z
Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module
Alexandre Micol, Adrien Zéanh, Olivier Dalverny and Moussa Karama Advanced Materials Research 112 83 (2010) https://doi.org/10.4028/www.scientific.net/AMR.112.83
Viscoplastic Behaviour Reliability Analysis of IGBT Module Solders
A. Micol, C. Martin and M. Mermet-Guyennet IFAC Proceedings Volumes 43 (3) 80 (2010) https://doi.org/10.3182/20100701-2-PT-4012.00015
Reliability of lead-free solder in power module with stochastic uncertainty
A. Micol, C. Martin, O. Dalverny, M. Mermet-Guyennet and M. Karama Microelectronics Reliability 49 (6) 631 (2009) https://doi.org/10.1016/j.microrel.2009.02.025