Articles citing this article

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Cited article:

Simulation assessment of solder joint reliability for fully assembled printed circuit boards

Sofiane SAAD, Gowthamraj SAMPATHKUMAR and Renan LEON
Microelectronics Reliability 153 115320 (2024)
https://doi.org/10.1016/j.microrel.2023.115320

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Amer Mecellem, Soufyane Belhenini, Douaa Khelladi and Caroline Richard
Microelectronics International 41 (3) 172 (2024)
https://doi.org/10.1108/MI-01-2024-0026

Sensing technologies for condition monitoring of oil pump in harsh environment

Narendra Lakal, Ali H. Shehri, Keith W. Brashler, Sahil P. Wankhede, Jeffrey Morse and Xian Du
Sensors and Actuators A: Physical 346 113864 (2022)
https://doi.org/10.1016/j.sna.2022.113864