International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO)

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Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag

S. Jayesh and J. Elias

Int. J. Simul. Multidisci. Des. Optim., 10 (2019) A11

Published online: 01 July 2019

DOI: 10.1051/smdo/2019013

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