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Identification of the Sn96.5Ag3.5 Law Behavior with the Scatter of the Parameters - Study of Aeronautical Application in Power Module

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DOI: 10.4028/www.scientific.net/AMR.112.83
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Reliability of lead-free solder in power module with stochastic uncertainty

A. Micol, C. Martin, O. Dalverny, M. Mermet-Guyennet and M. Karama
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DOI: 10.1016/j.microrel.2009.02.025
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Importance of test parameters, specimen type and use configuration on the identification of Sn/Ag solder behaviour laws

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Microelectronics Reliability 82 213 (2018)
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Viscoplastic Behaviour Reliability Analysis of IGBT Module Solders

A. Micol, C. Martin and M. Mermet-Guyennet
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